http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003113477-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31
filingDate 2001-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c71f737e6b2a47a955f91dd35472143
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publicationDate 2003-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003113477-A
titleOfInvention Electroless plating equipment
abstract (57) [Problem] To provide an electroless plating apparatus capable of greatly suppressing deposition of a plating metal on a substance other than an original work. SOLUTION: The plating tank has a double tank structure composed of an electroless plating main tank made of glass and a storage tank, and is filled in a space formed inside the storage tank and outside the electroless plating main tank. Temperature adjusting means for adjusting the temperature of the liquid for heating the electroless plating solution, and removing the impurities contained in the electroless plating solution by passing the electroless plating solution through a filter. And a deactivator for cooling the electroless plating solution before passing through the filter to reduce the activation of the adhesion of the plating metal to the filter.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200145920-A
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priorityDate 2001-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 24.