http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003105569-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18
filingDate 2001-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cfd8d1ef7d1f17da27111b3fe44ec51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35b8b7159b6a508e1cafc18c21a54946
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publicationDate 2003-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003105569-A
titleOfInvention Copper-containing metal material surface roughener and surface treatment method for copper-containing metal material
abstract PROBLEM TO BE SOLVED: To provide a good copper-containing metal material surface roughening agent capable of giving good adhesion even when used for improving the adhesion to a laminated material, and a copper-containing metal using the same. Provided is a method for surface roughening a material. SOLUTION: An aqueous solution containing an inorganic acid, an oxidizing agent for copper and an azole compound is further added with the formula (1). (Wherein R 1 , R 2 and R 3 each independently represent hydrogen, an alkyl group or alkylene group having 1 to 8 carbon atoms or a carbon atom which may be substituted with an alkyl group having 1 or 2 carbon atoms) An amide compound represented by an aryl group having 6 to 8 atoms) is added to obtain a surface roughening agent for a copper-containing metal material.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005290423-A
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