abstract |
(57) [Summary] A moisture-curable hot melt adhesive, comprising: It can be applied to the adherend at a low temperature of 00 ° C or less, Provided is a moisture-curable hot-melt adhesive that exhibits sufficient structural strength after moisture-curing. SOLUTION: Per 100 parts by mass of liquid alkyldialkoxysilyl group-containing polyoxypropylene, a tackifier resin 100 to 500 that can be dissolved or stably dispersed in an alkyldialkoxysilyl group-containing polyoxyalkylene. We have proposed a moisture-curable hot-melt adhesive whose main component is a composition obtained by dissolving or dispersing parts by mass at a temperature of 100 to 200 ° C. |