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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J171-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04
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filingDate 2001-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab3eb31d0ee2c63ef4dbde1bce1dc34f
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publicationDate 2003-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003105303-A
titleOfInvention Moisture-curable hot melt adhesive and method for producing the same
abstract (57) [Summary] A moisture-curable hot melt adhesive, comprising: It can be applied to the adherend at a low temperature of 00 ° C or less, Provided is a moisture-curable hot-melt adhesive that exhibits sufficient structural strength after moisture-curing. SOLUTION: Per 100 parts by mass of liquid alkyldialkoxysilyl group-containing polyoxypropylene, a tackifier resin 100 to 500 that can be dissolved or stably dispersed in an alkyldialkoxysilyl group-containing polyoxyalkylene. We have proposed a moisture-curable hot-melt adhesive whose main component is a composition obtained by dissolving or dispersing parts by mass at a temperature of 100 to 200 ° C.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005073333-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2005073334-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006291021-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004323660-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007142067-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5864430-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7671144-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4503939-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4750559-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012197388-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012053478-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009024107-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015078370-A
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