http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003105170-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2001-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3a9da31b49e429237329ce52da6fa25 |
| publicationDate | 2003-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003105170-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation having characteristics excellent in solder crack resistance, moisture resistance reliability, and high-temperature storage property. SOLUTION: It is selected from (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a compound represented by general formulas (1) to (3). One or more kinds and (F) a compound represented by the general formula (4) are essential components, and the component (E) is included in the total epoxy resin composition in an amount of 0.1%. An epoxy resin composition for semiconductor encapsulation, wherein the content of the component (F) is 0.01 to 5% by weight in the total epoxy resin composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111560232-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006213849-A |
| priorityDate | 2001-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.