| abstract |
(57) Abstract: A flame-retardant resin composition exhibiting good flame retardancy and excellent in adhesiveness, solder heat resistance, and laminating processability, and an adhesive sheet and cover for a semiconductor device containing the same. Provide lay film and flexible printed wiring board. The flame-retardant resin composition comprises (A) an epoxy resin containing phosphorus in the molecule, and (B) a triazine-modified phenol novolak resin, and comprises the flame-retardant resin composition. An adhesive sheet for a semiconductor device having an adhesive layer and at least one peelable protective film layer, a cover comprising a laminate of an insulating film coated with the flame-retardant resin composition and a peelable protective film. A flexible printed wiring board obtained by bonding an insulating film and a copper foil via a lay film and an adhesive layer made of the flame-retardant resin composition. |