| abstract |
PROBLEM TO BE SOLVED: To provide a material for an organic insulating film and an organic insulating film which are excellent in electric properties, thermal properties, mechanical properties and physical properties, and particularly low in dielectric constant and excellent in heat resistance. SOLUTION: For an organic insulating film having a polybenzoxazole resin precursor represented by the general formula (7) as a main structure obtained by reacting a bisaminophenol compound having a bulky structure with a dicarboxylic acid compound. The material is further subjected to a dehydration condensation reaction to form an organic insulating film. Embedded image |