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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
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filingDate 2001-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2a31fcc612113c3e0133010da71ca83
publicationDate 2003-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003105059-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Summary] [Problem] To have a high heat strength, Ni, Ni-Pd, Ni-P An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation having excellent adhesiveness to various members such as a pre-plating frame such as d-Au. SOLUTION: (A) an epoxy resin, (B) a phenol resin, (C) a silane coupling agent represented by the general formula (1) having an amide bond, a carboxy group and an alkoxy group, (D) an inorganic filler, (E) An epoxy resin composition for semiconductor encapsulation comprising a curing accelerator as an essential component. Embedded image (R1 is an alkoxy group having 1 to 3 carbon atoms, R2 is an alkoxy group having 1 carbon atom Or an alkyl group having 1 to 3 carbon atoms or an alkoxy group having 1 to 3 carbon atoms. a is an integer of 1 to 3 as an average, and b is an integer of 1 to 5)
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100934558-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20060077799-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100669508-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005336362-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102587322-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190065067-A
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Total number of triples: 52.