| abstract |
PROBLEM TO BE SOLVED: To provide a dicing adhesive sheet for fixing a semiconductor component such as a semiconductor wafer when dicing, and to prevent chipping at the time of dicing and scattering of the semiconductor component. Provided is a method of manufacturing a semiconductor component by performing dicing using the pressure-sensitive adhesive sheet for dicing. SOLUTION: In the pressure-sensitive adhesive sheet for semiconductor component dicing, in which a pressure-sensitive adhesive layer is laminated on a substrate film, the radiation-curable first pressure-sensitive adhesive layer is formed on the first pressure-sensitive adhesive layer from the substrate film side, and then on the first pressure-sensitive adhesive layer. An adhesive sheet for dicing semiconductor parts, wherein a non-radiation-curable second adhesive layer is laminated. |