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filingDate 2001-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc9a57f71cc7d7eb772f50137d55fbde
publicationDate 2003-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003096273-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in solder resistance, high-temperature storage property, and moisture resistance reliability. SOLUTION: (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, (E) an inorganic flame retardant and / or an ion scavenger containing a metal element, And (F) a chelate functional group-containing additive as an essential component, The chelate functional group-containing additive is 0.03 to 0.5% by weight of the total epoxy resin composition, the cured product of the epoxy resin composition has a pH of 5 to 8, and the epoxy resin composition has a pH of 5 to 8; An epoxy resin composition for semiconductor encapsulation, wherein the cured product has a glass transition temperature of 150 ° C. or lower.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006124418-A
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