http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003096269-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-47 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2001-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b |
| publicationDate | 2003-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003096269-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition excellent in adhesion, flame retardancy and solder stress resistance. (A) an epoxy resin represented by the general formula (1), (B) a phenol resin represented by the general formula (2), (C) all inorganic substances, (D) curing accelerator, and (E) Nt -Butyl-2-benzothiazolylsulfanamide as an essential component, and all inorganic substances are contained in 84% of the total epoxy resin composition. % Of Nt-butyl-2-benzothiazolylsulfanamide in the total epoxy resin composition, and 0.01 to 0.1% by weight of the total epoxy resin composition. And an epoxy resin composition for encapsulating a semiconductor, wherein each of the antimony atoms and the antimony atom is 0.05% by weight or less. |
| priorityDate | 2001-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.