http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003096268-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
filingDate 2001-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2a31fcc612113c3e0133010da71ca83
publicationDate 2003-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003096268-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation excellent in fluidity and filling property during molding. An essential component is (A) a phenol aralkyl type epoxy resin containing a diphenylene skeleton, (B) a phenol aralkyl type containing a diphenylene skeleton, (C) a curing accelerator, and (D) an inorganic filler. Laser diffraction / scattering method (1) Average particle size of 60 μm or more to 8 75% by weight or more to 85% by weight or less of fused spherical silica having a logarithmic standard deviation of 0.5 or less and less than 0 μm; 10% by weight to 20% by weight of fused spherical silica having a logarithmic standard deviation of 0.5 to 0.5 μm, and (3) fused spherical silica having a logarithmic standard deviation of 0.5 to 1 μm to less than 5 μm. An epoxy resin composition for semiconductor encapsulation, comprising from 2% by weight to 8% by weight, and containing fused spherical silica of 2% by weight or less of fine silica having a particle size of 0.5 μm or less.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7354978-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1557880-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008248004-A
priorityDate 2001-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419518532
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414871446
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8934
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID335
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456171974
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12749
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID160670958
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452414948
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451680633
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID170190
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9214
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID164912
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412798128
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID32524
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425334797
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID168856
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID409357749
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415861776
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425042019
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14618994
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458392451
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452381074

Total number of triples: 41.