http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003096165-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate | 2001-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b63c6f31f9d9f92b277d51e6aadcee6d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b408a4fe242c580a6f0b6aad937fd31 |
| publicationDate | 2003-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003096165-A |
| titleOfInvention | Thermosetting resin composition, epoxy resin molding material using the same, and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide a thermosetting resin composition and an epoxy resin molding material which are excellent in curability, fluidity and preservability and have excellent moisture resistance reliability, and a semiconductor device using the same. A compound having two or more epoxy groups in one molecule (A), a compound having two or more phenolic hydroxyl groups in one molecule (B), a bisphosphoranylidene ammonium borate compound having a specific structure (C) A thermosetting resin composition containing, as an essential component, an epoxy resin molding material containing the same, and a semiconductor device sealed with the cured product. |
| priorityDate | 2001-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 88.