| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C2029-1206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-34 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C29-1201
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C29-04 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-544 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11C11-419
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11C29-04 |
| filingDate |
2001-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9aa5813db9f94043591e7270813fcaa3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c76d480a5c0c99f0dc57bcf7866b9f55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59af9f163860351d1ca549dbf004f54b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a58f0fcf3944c725afa7a8b940f19d3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aad1291a19e54cd71e562bab906b409f |
| publicationDate |
2003-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003084042-A |
| titleOfInvention |
Semiconductor device and its inspection device |
| abstract |
(57) Abstract: A semiconductor device that can be effectively inspected by an inspection device even if the semiconductor device has a reduced chip size and a reduced pad pitch. A plurality of pads (2) are provided at both ends of a semiconductor substrate (1). a and 2b are formed, and the input pad group 2a is And an input / output pad group 2b is arranged on the right end side. The BIST circuit 10 is arranged at the upper right end of the semiconductor device 1 and A pad near the ST circuit 10 is the BIST-dedicated pad 3a. As the number of input pads increases, the area for arranging BIST pads is limited, and all BIST pads are used in the semiconductor device 1. The BIST pad is divided at both ends of the semiconductor device 1, the one near the BIST circuit 10 is a dedicated pad 3 a, the other is a shared pad 3 b, and the pads 3 a and 3 b are connected to the semiconductor device 1. Is divided into upper and lower areas. It is not necessary to form a large number of beams only in the upper region or the lower region of the inspection device, and the problem of strength and the difficulty in production can be solved. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2004102653-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2004102653-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9183892-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011508936-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7342248-B2 |
| priorityDate |
2001-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |