| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 |
| filingDate |
2001-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b60a7bbd8a53df9b805291155fe4437
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e9d397f76a4c49f5458ac694343dd5e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fae7d2caa7d783c23bdea1056f2d11dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a164e6543a83b4877c835cb71839199f |
| publicationDate |
2003-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003082297-A |
| titleOfInvention |
Adhesive film for die bonding and semiconductor device using the same |
| abstract |
(57) [Summary] To fix a semiconductor element and an electrode member, provide a stable fixing strength without variation in coating amount, and Provide an adhesive film for die bonding that is excellent in workability and productivity during coating. The adhesive film for die bonding is made of polycarbodiimide. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9221073-B2 |
| priorityDate |
2001-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |