| abstract |
(57) Abstract: In a conductive resin composition comprising (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) a conductive filler as essential components, ) The component (A) and / or component (B) is obtained by reacting an epoxy resin or a phenol resin having two or more units of the formula (1) in one molecule with an organopolysiloxane of the formula (2). It is a copolymer. Embedded image (R 1 ) a (R 2 ) b SiO (4-ab) / 2 (2) (R 1 is a monovalent organic group containing an amino group, an epoxy group, a hydroxy group or a carboxyl group, a hydrogen atom, a hydroxy group , An alkoxy group or an alkenyloxy group, R 2 is a monovalent hydrocarbon group, and a and b are positive numbers.) (II) The organopolysiloxane component in the cured product does not form a phase-separated structure. [Effect] The conductive resin composition of the present invention has both adhesiveness, heat resistance, moisture resistance, flexibility, and impact resistance. |