| abstract |
(57) [Problem] To provide a photosensitive thermosetting resin composition having excellent heat resistance, chemical plating resistance, resolution and the like as a solder resist. SOLUTION: (A) An epoxy resin (A1) having two or more epoxy groups is reacted with a monocarboxylic acid (A2) having one vinyl, and further a saturated or unsaturated polyhydric anhydride (A3). Photopolymerized prepolymer (formula I), (B) photopolymerized vinyl monomer (B1) And / or a diluent selected from organic solvents (B2) alone or in combination, (C) a photopolymerization initiator, (D) having two epoxy groups per molecular unit and not dissolving in a diluent to be used at room temperature. And / or epoxy resin containing epoxy resin (D2) having at least two epoxy groups in a molecular unit and dissolving at room temperature in a diluent used. And (E) an inorganic filler. [Formula 1] (Formula I) |