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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
filingDate 2002-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c979eb7385c9cec24764a16d3497a2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b156fccee8ca1b23d6e152d59de4b812
publicationDate 2003-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003073649-A
titleOfInvention Adhesive and adhesive layer
abstract [57] [Problem] To stabilize various metal adherends for printed wiring boards and other industrial parts that have excellent adhesion strength between a coated metal and an adhesive layer even in wiring with higher density and higher pattern accuracy. Establish adhesive technology that can be provided by SOLUTION: A thermosetting resin and / or a homogenous mixture of a photosensitive resin and a thermoplastic resin is used as a heat-resistant resin matrix of an adhesive, and a quasi-homogeneous compatible structure and a co-continuous structure obtained by curing the same. Alternatively, an adhesive and an adhesive layer using a homogeneous resin composite having a spherical domain structure as a heat-resistant resin matrix of the adhesive layer.
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