http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003073528-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
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filingDate 2001-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20b0512340a09710bece4542f86e2ff0
publicationDate 2003-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003073528-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation which is small in warpage after molding or soldering and is suitable for an area mounting type semiconductor device. SOLUTION: An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a triglycerin fatty acid ester as essential components. (E) is obtained by esterifying triglycerin and a saturated fatty acid having 16 to 36 carbon atoms, and component (E) is 0.05 to 0.5% by weight in the total epoxy resin composition; An epoxy resin composition for area mounting type semiconductor encapsulation, characterized in that the material accounts for 80 to 94% by weight of the total epoxy resin composition.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11104793-B2
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priorityDate 2001-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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