http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003072880-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c62268de3e92657ca5b9adcac4778225 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D1-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D85-86 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D1-09 |
| filingDate | 2001-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c22d4f368747cb2fe1b12a83cdf28655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e25c6ed1c18abf5eafebf312a79f66f |
| publicationDate | 2003-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003072880-A |
| titleOfInvention | IC package |
| abstract | (57) [Problem] To provide an IC package excellent in processability and conductive stability at low cost and easily. A temperature of 20 to 160 ° C. when 100 parts by mass of silicone rubber is filled with 60 parts by mass of carbon black. An IC package comprising a conductive resin molded product filled with carbon black having a volume resistivity gradient of 0.03 Ωcm / ° C. or less. In particular, Lc is 25 Å Above, it is preferable to use carbon black having a DBP absorption of 70 to 95 ml / 100 g and an iodine adsorption of 45 to 55 mg / g. An IC package, wherein a portion that comes into contact with an IC is formed of the above-mentioned conductive resin molded product. The above IC package, wherein the IC package is an IC tray. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007254608-A |
| priorityDate | 2001-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.