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publicationDate 2003-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003069363-A
titleOfInvention Crystal device
abstract (57) Abstract: A thermal shock when a lid cannot be firmly joined to a substrate due to a difference in linear thermal expansion coefficient between the substrate and the lid, and the lid is simultaneously attached to the substrate. This causes cracks in the substrate. A substrate having a wiring layer and a metal frame. And a crystal device 7 including a crystal resonator 5, a lid 3, and a semiconductor element 6, wherein the base 1 has a linear thermal expansion coefficient of 14 × 10 −6 / ° C. to 20 × 10 −6 / ° C. (40-40 0 ° C.), the rigidity of the lid 3 is 50 GPa or less, and 3 to 12% by weight of phosphorus and 5 to 20% by weight of gold in at least a region of the metal frame 12 where the lid 3 is welded. A second nickel plating layer 11b containing 5 to 20% by weight of gold in at least a region of the wiring layer 2 connected to an external electric circuit. Was deposited.
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