| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1da69bc62379dae673cedff424b689b2 |
| publicationDate |
2003-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003068681-A |
| titleOfInvention |
Polishing method and apparatus |
| abstract |
(57) [Object] To provide a method and apparatus for polishing a substrate such as a semiconductor wafer, which can eliminate a cap film and can simplify a semiconductor manufacturing process. In a method of polishing a semiconductor wafer by sliding it on a polishing tool, a film on the semiconductor wafer is polished in a dry state without moisture at an interface where the semiconductor wafer is in contact with the polishing tool. I do. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9012246-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011138580-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9969046-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015131361-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10259098-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I719123-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9579768-B2 |
| priorityDate |
2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |