| abstract |
(57) [Summary] (with correction) [PROBLEMS] To provide a method for forming a copper-resin composite material. SOLUTION: The forming method is 1): a step of attaching palladium or a palladium-tin catalyst on a resin substrate, 2): After step 1), the resin substrate to which the catalyst has adhered is treated with an electroless copper plating solution containing copper ions and a reducing agent without performing an accelerating process on the catalyst to form a thin copper film on the resin substrate. 3): After the step 2), and before the oxide film is formed on the surface of the copper thin film on the resin substrate, the resin substrate having the copper thin film is subjected to electrolytic copper plating, and Step 4) of forming a resin composite intermediate material: After the step 3), the copper-resin composite intermediate material is etched or polished; and 5): After the step 4), the etched or polished copper-resin composite intermediate material is subjected to electrolytic copper plating or Perform pattern formation processing. |