http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003064157-A

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filingDate 2001-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2003-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003064157-A
titleOfInvention Epoxy resin composition and semiconductor device
abstract (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation having characteristics excellent in moldability, solder crack resistance, and flame retardancy. (A) a phenol aralkyl type epoxy resin containing a diphenylene skeleton, (B) a phenol aralkyl resin containing a diphenylene skeleton, (C) a curing accelerator, An epoxy resin composition for semiconductor encapsulation, comprising (D) an inorganic filler and (E) diallyl bisphenol as essential components.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101234842-B1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009051880-A
priorityDate 2001-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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