abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation having characteristics excellent in moldability, solder crack resistance, and flame retardancy. (A) a phenol aralkyl type epoxy resin containing a diphenylene skeleton, (B) a phenol aralkyl resin containing a diphenylene skeleton, (C) a curing accelerator, An epoxy resin composition for semiconductor encapsulation, comprising (D) an inorganic filler and (E) diallyl bisphenol as essential components. |