| abstract |
(57) [Summary] [Object] To provide a method for manufacturing a non-contact IC card having a structure in which an inlet sheet and an outer sheet are laminated and having good surface smoothness. SOLUTION: When the inlet sheet and the outer cover sheet are laminated, they are sandwiched between heating press plates and subjected to heat press molding, and when performing lamination integration, a non-adhesive heating press plate is used as a press-side surface. And the surface roughness is Ra = One provided with a non-adhesive resin layer having a thickness of 1.0 μm or less is used. Examples of the non-adhesive resin layer include a fluororesin layer, for example, polytetrafluoroethylene, ethylene tetrafluoride-hexafluoropropylene copolymer, ethylene tetrafluoride-perfluoroalkyl vinyl ether copolymer, Preferred are fluorinated ethylene-ethylene copolymers, poly (chlorotrifluoroethylene), polyvinylidene fluoride, and the like. According to the production method of the present invention, the surface roughness is Ra = 1.0 μm The following non-contact IC cards can be manufactured. |