http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003055535-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc9a57f71cc7d7eb772f50137d55fbde |
| publicationDate | 2003-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003055535-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor encapsulation, which is excellent in solder resistance, high-temperature storage property and humidity resistance, suitable for encapsulating thin semiconductor devices such as LQFP and TSOP. . SOLUTION: (A) Epoxy resin, (B) phenolic resin, (C) curing accelerator, (D) inorganic filler, and (E) chelate functional group-containing additive are essential components, and a chelate functional group-containing additive is added. The agent is included in the total epoxy resin composition in an amount of 0. An epoxy resin composition for semiconductor encapsulation, wherein the amount is from 03 to 0.5% by weight. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006063136-A |
| priorityDate | 2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.