| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate |
2002-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c904652697a2ebe2a421e28cf506cb59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecd38b434e0710ff2ef1ff7a6738426b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d55325fe40d7c5160b13603d4510d3ff |
| publicationDate |
2003-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003051468-A |
| titleOfInvention |
CMP polishing method |
| abstract |
PROBLEM TO BE SOLVED: To provide a CMP polishing method capable of selectively polishing a surface to be polished with a stable polishing rate without a scratch and achieving high flatness. SOLUTION: Liquid A containing 0.5 to 10% by weight of cerium oxide particles, 0.003 to 0.3% by weight of a surfactant and water, and 1 to 50% by weight of a surfactant and water. A CMP method comprising mixing two liquids B and polishing the surface to be polished with a liquid mixture to which ultrasonic waves have been applied. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012091338-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101588895-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009025259-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009050920-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012091338-A2 |
| priorityDate |
2002-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |