| abstract |
PROBLEM TO BE SOLVED: To provide a novel compound, a dialkenyl diepoxy bisphenol-polysiloxane alternating copolymer, a derivative thereof, and a method for producing the same, and to further provide a mechanical strength and adhesion by blending the novel compound. Provided is an epoxy resin composition for electronic materials, particularly for semiconductor encapsulation, which has reduced stress and improved resistance to heat history without impairing the adhesiveness, adhesiveness and heat resistance. SOLUTION: A dialkenyl diepoxy bisphenol-polysiloxane alternating copolymer is produced by a hydrosilylation reaction between a dialkenyl diepoxy bisphenol (A) and a polysiloxane (B) having SiH groups at both ends of the molecule. And an epoxy resin composition for an electronic material, especially a semiconductor encapsulation by blending the alternating copolymer. |