http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003046021-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2001-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c979eb7385c9cec24764a16d3497a2d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cdbd3578848eb6bd6dfc7242eccaa9f1 |
| publicationDate | 2003-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003046021-A |
| titleOfInvention | Manufacturing method of IC chip mounting substrate |
| abstract | (57) [Problem] To provide a method for manufacturing an IC chip mounting substrate capable of achieving optical communication with excellent connection reliability and contributing to miniaturization of terminal equipment. A method for manufacturing an IC chip mounting substrate, comprising: preparing an optical element insertion substrate and a package substrate; bonding and bonding the substrates; and performing the following steps. (1) An optical element mounting step of electrically connecting the optical element to the conductor circuit of the package substrate after attaching the optical element to the surface of the package substrate exposed from the through hole formed in the optical element insertion substrate. (2) a resin-filled layer forming step of filling a resin composition into a through-hole formed in the optical element insertion substrate to form a resin-filled layer; (3) A through-hole forming step of forming a through-hole penetrating the optical element insertion substrate and the package substrate; and (4) forming a solder resist layer on an exposed surface of the optical element insertion substrate and an exposed surface of the package substrate. Forming a solder resist layer. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019212881-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7693382-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7338114-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102556703-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7070207-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8076782-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190136240-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8120040-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110556354-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110556354-A |
| priorityDate | 2001-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 80.