| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-12105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2001-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f658afa79619e646e1226310268f9eb7 |
| publicationDate |
2003-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003046019-A |
| titleOfInvention |
Multilayer printed wiring board and method for producing multilayer printed wiring board |
| abstract |
(57) [Summary] (With correction) [Problem] To provide a multilayer printed wiring board having a built-in semiconductor element and excellent in reliability, in which a crack or the like does not occur in a filled resin layer even under high temperature and high humidity or heat cycle conditions. . An interlayer resin insulation layer 50 and a conductor circuit 58 are formed on a substrate 30 in which a semiconductor element 20 is incorporated or accommodated. Are sequentially formed, and the semiconductor element 20 and the conductor circuit 3 are formed. 0, and a multilayer printed wiring board in which upper and lower conductor circuits are connected via a via hole 60, and the substrate 30 is made of a resin composition containing a thermosetting resin and an acid anhydride curing agent. A multilayer printed wiring board characterized in that the semiconductor element 20 is contained or accommodated through the formed filling resin layer 34. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101519038-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2005039094-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8450843-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014175406-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008270777-A |
| priorityDate |
2001-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |