http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003045830-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dbdfa36b677f4ef61245ca725011e221 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 |
| filingDate | 2001-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_865bd20b79f7b65f266780d8f3729475 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6661cc4dd35f682735057b2f02a4d1c |
| publicationDate | 2003-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003045830-A |
| titleOfInvention | Polishing pad for semiconductor, polishing apparatus using the same, and method for manufacturing semiconductor device using the same |
| abstract | PROBLEM TO BE SOLVED: To provide a polishing pad used for flattening a surface of a semiconductor wafer by a CMP polishing method, wherein a projection on the surface of the wafer is made uniform in a plane without causing scratches and cracks on the wafer surface. A polishing pad for flattening is formed. SOLUTION: A photopolymer composition containing a compound obtained by reacting a hydroxyl group-containing compound with a monoisocyanate and subjecting to urethane treatment is prepared, and the composition is formed into a sheet and then cured by light or heat. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010058220-A |
| priorityDate | 2001-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.