| abstract |
(57) [Problem] To provide a polyimide film having excellent fine workability and exhibiting sufficient heat resistance and adhesiveness, and an adhesive film comprising a polyimide-based adhesive. SOLUTION: An adhesive layer made of a solvent-soluble thermoplastic polyimide, an epoxy resin and a curing agent, which can be adhered at 200 ° C. or lower, is laminated on a protective film having a releasing property, and the thickness of the adhesive layer is 10 μm. By doing the following, unprecedented fine workability is realized. Further, by forming the adhesive layer from a soluble thermoplastic polyimide resin, an epoxy resin and a curing agent thereof, excellent adhesiveness and heat resistance are exhibited. |