| abstract |
(57) [Summary] [Problem] Cracks hardly occur in interlayer resin insulation layers, Provide a multilayer printed wiring board having excellent reliability. SOLUTION: A conductor circuit and an interlayer resin insulating layer are sequentially laminated on a substrate, the conductor circuits sandwiching the interlayer resin insulating layer are connected via via holes, and further, a solder resist layer is provided as an outermost layer. In the formed multilayer printed wiring board, among the via holes, via holes of different levels are stacked, and among the stacked via holes, at least one via hole is connected to another via hole. The via holes are stacked with their centers shifted, and the remaining via holes are stacked so that their centers substantially overlap other via holes. |