| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15747
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
| filingDate |
2002-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9f65ee06760a356a3f391bd5058ab8ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a4c8814685b4a3d6b236af5f8767f21 |
| publicationDate |
2003-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003017647-A |
| titleOfInvention |
Adhesive film for semiconductor |
| abstract |
(57) [Problem] To provide an adhesive film for a semiconductor which has a sufficient adhesive force to a lead frame, can be easily peeled off after sealing with a resin, and has various characteristics required for a semiconductor application. provide. SOLUTION: This is an adhesive film for semiconductor used for a method of attaching and protecting an adhesive film on the back surface of a lead frame, and peeling off after sealing, wherein a resin layer A is formed on one side or both sides of a support film. The support film has a coefficient of linear thermal expansion at 20 to 200 ° C. of 3.0 × 1. An adhesive film for a semiconductor having a temperature of 0 −5 / ° C. or less. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9822284-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015029871-A1 |
| priorityDate |
1999-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |