http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003012771-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2001-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecc633ac6fbea4925c42d8f68d341895 |
| publicationDate | 2003-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003012771-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition for encapsulating a semiconductor having excellent properties such as curability, storage stability and solder crack resistance. A phenol aralkyl type epoxy resin having a diphenylene skeleton, (B) a phenol aralkyl type resin having a diphenylene skeleton, (C) fused silica powder, and (D) a molecular compound represented by formula (4). An epoxy resin composition for semiconductor encapsulation. [Chemical 1] (P represents a phosphorus atom and Ph represents a phenyl group. M is 0 ≦ m. ≤1 indicates a number. ) |
| priorityDate | 2001-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 55.