http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003008173-A

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classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-42
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-382
filingDate 2001-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3900ed3941ab8c0e21952b6f565f611e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22bccf4e7640f08285550ec8cbc42184
publicationDate 2003-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2003008173-A
titleOfInvention Backup sheet for through-hole formation by carbon dioxide laser
abstract (57) [Summary] [Problem] To directly irradiate a carbon dioxide laser on a copper-clad plate, A backup sheet for forming a small-diameter through hole having a good shape is obtained. A low thermal conductivity layer is bonded to a lower copper foil of a thermosetting resin copper clad plate having at least two copper layers and used as a backup sheet, and a carbon dioxide laser is used. A through hole is formed by directly irradiating the copper foil with one energy selected from pulse energy of 5 to 60 mJ. Thereafter, in the case of a thick copper foil, a part in the thickness direction of the copper foil is removed by etching, and at the same time, the copper foil burr generated in the hole is dissolved and removed, and this is used as a printed wiring board. [Effect] It is possible to obtain a backup sheet that has a good hole shape and can open through holes with excellent reliability. A high-density printed wiring board having a small diameter and a fine circuit could be produced.
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