| abstract |
(57) [Problem] Conventionally, a semiconductor device in which a flexible sheet having a conductive pattern is used as a support substrate, a semiconductor element is mounted thereon, and the whole is molded has been developed. In this case, a problem that a multilayer wiring structure cannot be formed or a problem that warpage of the insulating resin sheet is remarkable in a manufacturing process occurs. SOLUTION: The conductive plating film 4 is formed after forming a through hole 21 in the insulating resin 2 by using an insulating resin sheet 1 in which one surface of a conductive film 3 is covered with an insulating resin 2. The first conductive wiring layer 5 formed by etching the first conductive wiring layer 5 and the second conductive wiring layer 6 connected in multiple layers realize a multilayer wiring structure. Further, by fixing the semiconductor element 7 on the overcoat resin 8 covering the first conductive wiring layer 5, the first conductive wiring layer 5 has a fine pattern and can be freely routed. |