| abstract |
(57) [Problem] To provide a multilayer printed wiring board that can be directly electrically connected to an IC chip without using a lead component. SOLUTION: The multilayer printed wiring board has an IC chip 20 built in a core substrate 30 in advance, and a copper die pad 24 of the IC chip 20 has a first thin film layer 33, a second thin film layer 36, a thick film. A transition layer consisting of 37 is provided at 38. Therefore, the electrical connection between the IC chip and the multilayer printed wiring board can be established without using a lead component or a sealing resin. In addition, by providing a plurality of transition layers 38 on the die pad 24, the connectivity and reliability between the die pad 24 and the via hole 60 are improved. |