http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003007665-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34263a1d9767236ba10183da556a136b |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92125 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2001-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd897de497eaae0bf94a6775fbcd9b88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d01239ace8ec3bbe1504bd0f5158681 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ecfae32c79b83d1c8409ed06cd3ff59 |
| publicationDate | 2003-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003007665-A |
| titleOfInvention | Method for manufacturing semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To prevent cracking of a semiconductor wafer in a cleaning step of a flux or the like adhering to a semiconductor wafer surface, Improve cleaning accuracy of semiconductor wafers. SOLUTION: A solder paste obtained by kneading a flux and solder powder is formed on a bonding pad portion (underlying metal layer) by screen printing, and then subjected to heat treatment to form a semiconductor wafer W on which a solder bump electrode is formed. Is fixed on a stage 102b in the cleaning device 101, Cleaning is performed by spraying a cleaning liquid 106 from a cleaning nozzle 105 while rotating the semiconductor wafer W in the direction of the arrow in the figure. As a result, cracking of the semiconductor wafer W can be prevented, and flux and fine solder particles on the surface of the semiconductor wafer W can be removed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100437923-C |
| priorityDate | 2001-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.