| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-375
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2001-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c570f059efb157410e1e41de524a290d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1db7d1b2d5c754e4c7eeaec5aefc220 |
| publicationDate |
2003-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003003044-A |
| titleOfInvention |
Resin composition for semiconductor encapsulation and semiconductor device |
| abstract |
(57) [Problem] To provide a resin composition for semiconductor encapsulation capable of increasing the adhesive strength to a lead frame and improving the adhesion. SOLUTION: It contains an epoxy resin, a curing agent thereof and a nickel complex. |
| priorityDate |
2001-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |