Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0263 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-202 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10272 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0969 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0201 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3447 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
filingDate |
1999-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2002-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2002538749-A |
titleOfInvention |
Busbar assembly |
abstract |
SUMMARY A busbar assembly (10) having improved soldering characteristics has a solder island (70) having a central solder hole (64) surrounded by a thermal barrier hole (66). |
priorityDate |
1999-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |