http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002536846-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76844 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
| filingDate | 2000-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2002-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002536846-A |
| titleOfInvention | Method of manufacturing vertical metal connections in integrated circuits |
| abstract | An integrated circuit having a copper metallization level is provided using a damascene type process for making integrated circuit vias to prevent copper particles from diffusing into a dielectric material. SOLUTION: At least one layer of a dielectric material 3 is deposited on a copper track 1 covered by an encapsulation layer 2. The cavity 6 is etched in the layer of dielectric material at the location of the future vertical connection. At least one protective layer is deposited on the cavity to eliminate copper 7 diffusion. The protective layer 7 at the bottom of the cavity 6 is anisotropically etched, and the encapsulation layer 2 is also etched, after which the cavity is filled with copper. During the etching of the encapsulation layer, the finely divided copper particles do not contaminate the dielectric material 3. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009246394-A |
| priorityDate | 1999-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.