http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002534684-A

Outgoing Links

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49117
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0735
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-06
filingDate 1999-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2002-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002534684-A
titleOfInvention Inspection probe interface assembly and manufacturing method
abstract Abstract: An interface module for inspecting integrated circuits and a method of manufacturing are disclosed, wherein a flat freestanding diaphragm (21) supports signal transmission paths (22), the signal transmission paths extending from the diaphragm. The probe contacts are aligned with the pattern of the integrated circuit access pad (26). The diaphragm is resiliently connected to the flat printed circuit board (11) in a plane substantially parallel to that plane. A floppy board (16) is positioned between the printed circuit board (11) and the diaphragm (21) to form a signal transmission path from the printed circuit board (11) to the free standing diaphragm (21). You. The manufacturing method involves laser positioning and laser drilling of holes to produce dense, precisely positioned small diameter holes (23) in a free standing diaphragm material (11), thereby increasing high probe contact density to an unlimited pattern. Including the step of obtaining in an array.
priorityDate 1999-01-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 18.