| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07314 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06716 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate |
1999-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2002-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2002530877-A |
| titleOfInvention |
Probe assembly for testing |
| abstract |
(57) Abstract: A device for probing a semiconductor wafer comprises one or more probe tips (30), each position of which is self-adjustable according to the magnitude and direction of the pressure applied to the probe tips. (38, 40). According to the present invention, the resilient probe assembly (16) comprises a probe tip (30) and moves independently as the size of the wafer under test increases due to thermal effects and / or changes in probe pressure. To compensate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102532503-B1 |
| priorityDate |
1998-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |