| abstract |
(57) Summary A package (104) for encapsulating electronic components (102, 122, 550, 660) has at least two chambers (112, 212). The electronics and modules in the chambers are interconnected by a lead frame (130) extending between the two chambers. One chamber may surround the other chamber (FIGS. 1A, 2A), or one chamber may be adjacent to the other chamber (FIGS. 4, 4A, 8A, 9A). . The side wall (310) of one chamber (314) is higher than the side wall (308) of the other chamber (312). Each chamber can be individually filled with encapsulation material (713, 715). After filling one chamber with the encapsulant, it can be temporarily connected (742) to the leadframe, after which the other unfilled chamber of the package is filled with the encapsulant. A part of the lead frame may extend to the outside of the package. Openings (656, 658) may be provided on the outer surface of the package for connection with external components (650). The electronics may include an RF transponder and a pressure sensor, and the package may be mounted in a pneumatic tire (1012). |