| abstract |
(57) Abstract: An interconnection element (550) for an electronic component (556), which exhibits desired mechanical properties (eg, elasticity) and is made of a ribbon made of a soft material (eg, gold or soft copper). The core element (552) is formed to have a spring shape (including a cantilever beam, S-shape, C-shape, U-shape), and the formed core element is covered with a hard material (558) such as nickel and its alloy. The coating forms a pressure contact by imparting the desired spring (elastic) properties to the resulting composite interconnect element (550). A final overcoating of a material (220) having excellent electrical qualities (eg, conductive and / or solderable) is applied to the composite interconnect element (200). The resulting interconnect elements (500, 550) are attachable to various electronic components. |