| abstract |
(57) Abstract: An object of the present invention is to provide a resin-sealed module device having a small size, low warpage, high airtightness, excellent mass productivity and temperature cycle reliability, and high mass productivity, and production thereof. There is a way to provide. The present invention relates to a resin-sealed module device in which a plurality of circuit elements are mounted on a wiring board and the elements are electrically connected to outer leads, wherein at least one of the elements is a thermosetting resin. It is characterized by being sealed with a composition, wherein the entirety of the wiring substrate and all of the elements and the connection side of the outer leads to the substrate are resin-sealed by transfer molding. |