http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002363788-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25B9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C02F1-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25B15-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-20 |
| filingDate | 2001-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0ba2b7754745096dbfb8aed311c7186 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da2a44be0307c961f2e7e659e514729b |
| publicationDate | 2002-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002363788-A |
| titleOfInvention | Chemical treatment apparatus, plating treatment apparatus, chemical treatment method, plating treatment method, residue removal treatment method, semiconductor device manufacturing method and printed circuit board production method using the same |
| abstract | PROBLEM TO BE SOLVED: To provide a chemical treatment device (plating treatment device) and a chemical treatment method (plating treatment method) using a closed-type treatment cup through which a treatment solution (plating solution) flows inside at a certain pressure and flow rate. In the above, the retention of bubbles in the member to be processed is prevented, and the occurrence of processing defects due to the retention of bubbles is reduced. SOLUTION: A processing solution (plating solution) is placed in a closed processing cup. , At least one of the pressure and the flow rate of the processing liquid (plating liquid) flowing through the closed processing cup is periodically changed. In addition, the flow direction of the processing liquid (plating liquid) flowing in the closed processing cup is periodically changed. In a method for manufacturing a semiconductor device and a method for manufacturing a printed circuit board, a semiconductor wafer and a printed circuit board are arranged in a closed processing cup such that an open opening of a blind hole comes into contact with a processing solution (plating solution) flowing therethrough. Elimination of air bubbles, improving production yield, Alternatively, the performance of the product is improved. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019014236-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11739434-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100393917-C |
| priorityDate | 2001-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.