http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002363384-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18 |
| filingDate | 2001-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39ef7424ff721b11dda09a52a5f8a1b |
| publicationDate | 2002-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2002363384-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation which is excellent in fluidity, filling properties, burr characteristics, and soldering stress resistance. SOLUTION: (A) An epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) fused spherical silica are essential components, and the fused spherical silica is contained in an amount of 84 to 94% by weight in the total epoxy resin composition. And the median diameter of the fused spherical silica is 2.0 × 10 to 4.0 × 10 μm, and the particle diameter is 5.0 × 1. Particles having a particle size of 0 to 2 μm or more and less than 1.0 μm have a particle size distribution of 5 to 20% by weight, and particles having a particle size of 1.0 μm or more and 2.0 × 10 μm or less have a particle size distribution of 20 to 40% by weight; Is 2.0 to 5.0 m 2 / g. |
| priorityDate | 2001-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.