| abstract |
PROBLEM TO BE SOLVED: To reduce the amount of warpage of a package in a tape carrier type BGA, improve the connection reliability of a mother boat, and reduce the occurrence of reflow cracks during solder reflow, Provided are a resin paste composition capable of improving reflow reliability and a semiconductor device having high productivity and high reliability using the same. SOLUTION: A (meth) acrylate compound represented by the general formula (I), a radical initiator and a filler are uniformly dispersed to form a composition. In addition, a semiconductor element is bonded to a supporting member using this composition, and then sealed to obtain a semiconductor device. Embedded image [In the formula, R1 represents a hydrogen atom or a methyl group, and n and m independently represents an integer of 0 to 6. ] |