| abstract |
[57] [Problem] High heat resistance, narrow pitch wiring pattern, small diameter via hole, uniform insulating layer thickness, moderately low coefficient of linear expansion, suitable for manufacturing highly reliable multilayer printed wiring boards. An object is to provide a conductor layer / polyimide film / adhesive laminate. SOLUTION: A conductor layer is formed on one surface of a polymer film, A laminate having an adhesive layer on the other surface, the laminate having a resin composition composed of a polyimide composed of an ester dianhydride and a specific diamine, and an epoxy resin in the adhesive layer. |